5G时代印制电路板(PCB)关键技术预见与产业协同创新机制研究
Release time:2024-08-19
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- Affiliation of Participant(s):
- 重庆工商大学
- Leading Scientist:
- Li Xiao Dan
- Supported by:
- 重庆市科技局
- Classification of Project:
- 人文社科类
- Nature of Project:
- 纵
- Supported by:
- 重庆市科委科学研究项目(含决策管理、基础研究、应用研发等项目)
- Project level:
- 3.省部级
- Project Participants:
- Guo WeiWei,黄云钟,曹磊磊
- Project Number:
- B60B980091EC6952E0536F001EACBE2B
- Date of Project Completion:
- 2021-01-31
- Date of Project Initiation:
- 2020-07-01
- Subsidy Amount(ten thousand yuan):
- 100000.0
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