配套-苯并噁嗪/氰酸酯纳米多孔复合材料的结构调控与介电性能
Release time:2024-08-19
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- Affiliation of Participant(s):
- 重庆工商大学
- Leading Scientist:
- Li Xiao Dan
- Supported by:
- 重庆工商大学
- Classification of Project:
- 自然科学类
- Nature of Project:
- 纵
- Supported by:
- 项目配套经费
- Project Participants:
- Fu Min,HYZ,何飞,韩红桔
- Project Number:
- PT20171218214505493
- Date of Project Completion:
- 2019-06-30
- Date of Project Initiation:
- 2016-07-01
- Subsidy Amount(ten thousand yuan):
- 30000.0
- Pre One:5G时代印制电路板（PCB）关键技术预见与产业协同创新机制研究
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