配套-低渗性不良地质体防渗加固纳米粒子-IPN结构协同改性聚氨酯复合注浆材料与技术
Release time:2024-08-19
Hits:
- Supported by:
- 重庆工商大学
- Classification of Project:
- 自然科学类
- Nature of Project:
- 纵
- Supported by:
- 项目配套经费
- Project Number:
- PT2022122714394915911
- Date of Project Completion:
- 2025-12-31
- Date of Project Initiation:
- 2022-01-01
- Subsidy Amount(ten thousand yuan):
- 150000.0
- Pre One:双性电磁屏蔽复合材料的可控制备及其效能表征
- Next One:配套-5G时代印制电路板（PCB）关键技术预见与产业协同创新机制研究