配套-5G时代印制电路板（PCB）关键技术预见与产业协同创新机制研究
Release time:2024-08-19
Hits:
- Supported by:
- 重庆工商大学
- Classification of Project:
- 人文社科类
- Nature of Project:
- 纵
- Supported by:
- 项目配套经费
- Project Number:
- PT20220908161113619
- Date of Project Completion:
- 2021-01-31
- Date of Project Initiation:
- 2020-07-01
- Subsidy Amount(ten thousand yuan):
- 60000.0
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