配套-利用废旧印刷电路板制备植物营养剂及3D打印材料研究
Release time:2024-11-28
Hits:
- Supported by:
- 重庆工商大学
- Classification of Project:
- 自然科学类
- Nature of Project:
- 纵
- Supported by:
- 项目配套经费
- Project Number:
- PT2024112617553450463
- Date of Project Completion:
- 2024-12-31
- Date of Project Initiation:
- 2023-01-01
- Subsidy Amount(ten thousand yuan):
- 10000.0
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