Affiliation of Author(s):

重庆工商大学

Journal:

包装工程

Place of Publication:

重庆

Key Words:

湿豆渣；挤压膨化；响应面；主成分分析

First Author:

赵久毅

Co-author:

游欢

Indexed by:

Journal paper

Correspondence Author:

唐春红

Document Code:

1001-3563(2022)01-0124-09

Discipline:

Engineering

First-Level Discipline:

Food Science and Engineering

Document Type:

J

Volume:

43

Issue:

1

Page Number:

124-132

Translation or Not:

no

Date of Publication:

2022-01-18

Included Journals:

CPCI-S