配套-适用于新型通信网络的高频高速PCB基板核心技术研发
Release time:2024-08-19
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- Affiliation of Participant(s):
- 重庆工商大学
- Supported by:
- 重庆工商大学
- Classification of Project:
- 自然科学类
- Nature of Project:
- 纵
- Supported by:
- 项目配套经费
- Project Number:
- PT20191212172954663
- Date of Project Completion:
- 2021-06-30
- Date of Project Initiation:
- 2019-07-01
- Subsidy Amount(ten thousand yuan):
- 120000.0
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