适用于新型通信网络的高频高速PCB基板核心技术研发
Release time:2024-08-19
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- Affiliation of Participant(s):
- 重庆工商大学
- Leading Scientist:
- Li Xiao Dan
- Supported by:
- 重庆市科技局
- Classification of Project:
- 自然科学类
- Nature of Project:
- 纵
- Supported by:
- 重庆市科委科学研究项目(含决策管理、基础研究、应用研发等项目)
- Project level:
- 3.省部级
- Project Participants:
- 冯欢,赵邦渝,MSY,Li Fukun,王洲一,张聪,刘小平,胡心雨,罗爽
- Project Number:
- QB77675QKJLLDT2EHUTB0XTTBFXGRPGW
- Date of Project Completion:
- 2022-06-30
- Date of Project Initiation:
- 2019-07-01
- Subsidy Amount(ten thousand yuan):
- 200000.0
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