配套-新型超低介电PCB基材的结构与性能
Release time:2024-08-19
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- Affiliation of Participant(s):
- 重庆工商大学
- Leading Scientist:
- Li Xiao Dan
- Supported by:
- 重庆工商大学
- Classification of Project:
- 自然科学类
- Nature of Project:
- 纵
- Supported by:
- 项目配套经费
- Project Participants:
- MSY,HYZ,何飞,韩红桔
- Project Number:
- PT20171219103604086
- Date of Project Completion:
- 2018-12-31
- Date of Project Initiation:
- 2017-01-01
- Subsidy Amount(ten thousand yuan):
- 30000.0
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