敖文刚

  • Personal Information
  • Birth Year:1976
  • Name (Pinyin): AWG
  • E-Mail:
  • School/Department: 智能制造服务国际科技合作基地
  • Education Level: 硕士研究生毕业
  • Degree: 工学硕士学位
  • Professional Title: Professor
  • Status: 在岗
  • Alma Mater: 重庆大学

Paper Publications

Current position: Home > Scientific Research > Paper Publications

板材包装结构强度分析与优化

Release time:2024-08-19
Hits:
Journal:
包装工程
First Author:
AWG
Co-author:
宋泽良,CHF,彭斯洋
Indexed by:
源刊论文
Document Code:
HJ2LPEAPQGS6L5T8HLSCDMGEGHTN6MD4
Issue:
13
Translation or Not:
no
Date of Publication:
2017-07-10